Optical Module PCB

As the most crucial component in the optical fiber communication industry, the optical module consists of optoelectronic devices, functional circuits, and optical interfaces. The optoelectronic devices comprise the transmission and reception parts. The transmission part takes an electrical signal with a specific bit rate as input, which is processed by an internal driver chip to drive a semiconductor laser (LD) or a light-emitting diode (LED) to emit a corresponding modulated optical signal at a certain speed. It incorporates an internal automatic optical power control circuit to ensure a stable output optical signal power. The reception part takes an optical signal with a specific bit rate as input, which is converted into an electrical signal by an optical detector diode within the module. It then outputs an electrical signal with a corresponding bit rate after amplification by a preamplifier.

 

 

With the rapid development of digital fiber-optic communication technology, the volume of data to be transmitted is increasing, and the speed is escalating. Fiber-optic transmission offers advantages such as high capacity, immunity to interference, and lightweight, making it extensively utilized. The development of high-speed and miniaturized optical modules is urgently required as a vital component in fiber-optic transmission links. Consequently, significant efforts have been devoted to researching the key technologies of optical module products, focusing on the production and control aspects of optical modules on PCBs. Corresponding improvement measures and parameters have been formulated to overcome the challenges associated with optical modules on PCBs. These efforts aim to provide technical support for the industrialization of optical modules in printed circuit boards.

 

In order to meet the solder and bonding requirements of different chips and device packages, some bonding ICs require a nickel-palladium-gold surface treatment process to fulfill the bonding requirements. This type of product involves mixed surface treatment processes, including plating printed plugs, nickel-palladium-gold, and nickel-gold. During the mixed surface treatment process, issues such as mixed soluction crossing or plating of different system solutions may occur. Therefore, high-end optical module PCB generally undergo a nickel-palladium-gold surface treatment process.

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